PolyVoc 2007
 
Inhalte
 
     
 
 
PolyLEO
 
   
Fehler bei der Anmeldung für den Benutzer 'polybase'.
Der Wortschatz von PolyLEO zeigt einen Auszug des elektonischen Wörterbuches PolyVoc.
Weitere Infos hier.
 
 

 |  Login

HOME ZEITSCHRIFTENLISTE IMPRESSUM


 
Minimize Quellenangaben zum Dokument unter www.polybase.com
 
   
Die nachfolgenden Dokumente entstammen der Datenbank APOLLIT des Datenbankportals POLYBASE.COM.
Weitere Informationen zum entsprechenden Dokument sind im kostenpflichtigen Bereich abrufbar.

Nähere Informationen zu den hinterlegten Datenbanken erhalten Sie hier.

Information zum Portal-Betreiber: Impressum
Allgemeine Geschäftsbedingungen

Dokument Nr.200300238 (klicken Sie bitte auf die Dokumentnummer um dieses Dokument anzuzeigen)
TitelBismaleimide resin modified with diallyl bisphenol A and diallyl p-phenyl diamine for resin transfer molding
AbstractO,O'-diallyl bisphenol A (DBA) and N,N'-diallyl p-phenyl diamine (DPD) were used for the reactive diluents of 4,4'-bismaleimidodiphenol methane (BDM). The objective was to obtain a modified BDM resin system suitable for resin transfer molding (RTM) process to prepare the advanced composites. The processing behavior was determined by time-temperature-viscosity curves, gel characteristics, and differential scanning calorimetry (DSC). The injection temperature of the resin system in RTM could be 80°C, at which its apparent viscosity was only 0.31 Pa/s, and the apparent viscosity was still less than 1.00 Pa/s after the resin was held at 80°C for 16 h. The gel time test result indicated that at low temperatures, the reactivity of the resin system is low, whereas at high temperatures, the resin could cure very fast, which was beneficial to RTM. The postcure of the cured resin at a given temperature was necessary because the resin had a wide and flat cure exothermic peak, observed by DSC curve. The cured resin displayed both high heat and hot/wet resistance and high mechanical properties, especially tensile strength, tensile modulus, and flexural strength at room temperature, which reached 96.2 MPa, 4.8 GPa, and 121.4 MPa, respectively. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2245-2250, 2001 (orig.)
Control terms engl.AMINES; BISPHENOL A; COMPOSITES; CURING; DILUTION; DSC; ELASTIC MODULUS; FLEXURAL STRENGTH; GEL POINT; POLYBISMALEIMIDES; PROCESSING TEMPERATURE; REACTIVE PROCESSING; RESIN TRANSFER MOLDING; TEMPERATURE; TENSILE STRENGTH; TIME; VISCOSITY
Control terms germanAMINE; BISPHENOL A; VERBUNDWERKSTOFFE; CURING; VERDUENNEN; DSC; ELASTIZITAETSMODUL; BIEGEFESTIGKEIT; GELPUNKT; POLYBISMALEINIMIDE; VERARBEITUNGSTEMPERATUR; REAKTIVE VERARBEITUNG; INJEKTIONSVERFAHREN; TEMPERATUR; ZUGFESTIGKEIT; ZEIT; VISKOSITAET